Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-3513-11H

32-3513-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,323 15.13

RFQ

32-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
126-93-314-41-002000

126-93-314-41-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,312 15.13

RFQ

126-93-314-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-314-41-002000

126-43-314-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,588 15.13

RFQ

126-43-314-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-318-41-001000

116-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,007 15.13

RFQ

116-41-318-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-318-41-001000

116-91-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,268 15.13

RFQ

116-91-318-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
17-0501-21

17-0501-21

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,320 15.13

RFQ

17-0501-21

Datasheet

Bulk 501 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
17-0501-31

17-0501-31

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,797 15.13

RFQ

17-0501-31

Datasheet

Bulk 501 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-20

24-0501-20

CONN SOCKET SIP 24POS TIN

Aries Electronics

3,024 15.13

RFQ

24-0501-20

Datasheet

Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-30

24-0501-30

CONN SOCKET SIP 24POS TIN

Aries Electronics

3,728 15.13

RFQ

24-0501-30

Datasheet

Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3503-21

16-3503-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,570 15.13

RFQ

16-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3503-31

16-3503-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,666 15.13

RFQ

16-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3503-20

30-3503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,619 15.13

RFQ

30-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3503-30

30-3503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,097 15.13

RFQ

30-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10E

24-4518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,629 15.13

RFQ

24-4518-10E

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-324-41-003000

116-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,852 15.14

RFQ

116-93-324-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-424-41-003000

116-93-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,376 15.14

RFQ

116-93-424-41-003000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-624-41-003000

116-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,323 15.14

RFQ

116-93-624-41-003000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-324-41-003000

116-43-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,485 15.14

RFQ

116-43-324-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-424-41-003000

116-43-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,456 15.14

RFQ

116-43-424-41-003000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-624-41-003000

116-43-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,826 15.14

RFQ

116-43-624-41-003000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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