Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-43-316-41-001000

612-43-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,707 15.08

RFQ

612-43-316-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-318-41-001000

612-91-318-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,997 15.03

RFQ

612-91-318-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-318-41-001000

126-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,861 15.04

RFQ

126-41-318-41-001000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-318-41-001000

126-91-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,317 15.04

RFQ

126-91-318-41-001000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-428-41-001000

110-13-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,002 15.04

RFQ

110-13-428-41-001000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-144-13-041135

546-83-144-13-041135

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3,058 14.25

RFQ

546-83-144-13-041135

Datasheet

Bulk 546 Active PGA 144 (13 x 13) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-144-13-041136

546-83-144-13-041136

CONN SOCKET PGA 144POS GOLD

Preci-Dip

2,285 14.25

RFQ

546-83-144-13-041136

Datasheet

Bulk 546 Active PGA 144 (13 x 13) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-179-18-111135

546-87-179-18-111135

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,251 14.29

RFQ

546-87-179-18-111135

Datasheet

Bulk 546 Active PGA 179 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-179-18-111136

546-87-179-18-111136

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,402 14.29

RFQ

546-87-179-18-111136

Datasheet

Bulk 546 Active PGA 179 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-93-318-41-008000

116-93-318-41-008000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,253 15.05

RFQ

116-93-318-41-008000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-318-41-008000

116-43-318-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,062 15.05

RFQ

116-43-318-41-008000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-318-31-002000

614-43-318-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,552 15.06

RFQ

614-43-318-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-318-31-002000

614-93-318-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,572 15.06

RFQ

614-93-318-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
33-0508-20

33-0508-20

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2,204 15.07

RFQ

33-0508-20

Datasheet

Bulk 508 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
33-0508-30

33-0508-30

CONN SOCKET SIP 33POS GOLD

Aries Electronics

3,302 15.07

RFQ

33-0508-30

Datasheet

Bulk 508 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-6501-21

28-6501-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,901 15.07

RFQ

28-6501-21

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-6501-31

28-6501-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,599 15.07

RFQ

28-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-322-41-007000

116-93-322-41-007000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,293 15.07

RFQ

116-93-322-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-422-41-007000

116-93-422-41-007000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,666 15.07

RFQ

116-93-422-41-007000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-322-41-007000

116-43-322-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,450 15.07

RFQ

116-43-322-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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