Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-624-41-008000

116-93-624-41-008000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,270 15.84

RFQ

116-93-624-41-008000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-324-41-008000

116-43-324-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,254 15.84

RFQ

116-43-324-41-008000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-424-41-008000

116-43-424-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,461 15.84

RFQ

116-43-424-41-008000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-624-41-008000

116-43-624-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,541 15.84

RFQ

116-43-624-41-008000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-328-41-001000

121-13-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,324 15.84

RFQ

121-13-328-41-001000

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-428-41-001000

121-13-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,995 15.84

RFQ

121-13-428-41-001000

Datasheet

Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-628-41-001000

121-13-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,003 15.84

RFQ

121-13-628-41-001000

Datasheet

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-432-41-001000

123-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,032 15.84

RFQ

123-93-432-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-432-41-001000

123-43-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,150 15.84

RFQ

123-43-432-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-6556-10

36-6556-10

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,655 15.84

RFQ

36-6556-10

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
116-47-642-41-006000

116-47-642-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,824 15.85

RFQ

116-47-642-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-324-31-002000

614-43-324-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,155 15.85

RFQ

614-43-324-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-424-31-002000

614-43-424-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,303 15.85

RFQ

614-43-424-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-624-31-002000

614-43-624-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,052 15.85

RFQ

614-43-624-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-324-31-002000

614-93-324-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,350 15.85

RFQ

614-93-324-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-424-31-002000

614-93-424-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,592 15.85

RFQ

614-93-424-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-624-31-002000

614-93-624-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,910 15.85

RFQ

614-93-624-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-432-41-007000

116-47-432-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,775 15.85

RFQ

116-47-432-41-007000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-632-41-007000

116-47-632-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,145 15.85

RFQ

116-47-632-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-318-41-002000

126-41-318-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,399 15.85

RFQ

126-41-318-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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