Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
111-43-432-41-001000

111-43-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,708 14.82

RFQ

111-43-432-41-001000

Datasheet

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-365-17-091111

517-87-365-17-091111

CONN SOCKET PGA 365POS GOLD

Preci-Dip

2,113 14.11

RFQ

517-87-365-17-091111

Datasheet

Bulk 517 Active PGA 365 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-365-14-000111

517-87-365-14-000111

CONN SOCKET PGA 365POS GOLD

Preci-Dip

3,445 14.11

RFQ

517-87-365-14-000111

Datasheet

Bulk 517 Active PGA 365 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-93-328-41-105000

110-93-328-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,882 14.85

RFQ

110-93-328-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-428-41-105000

110-93-428-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,077 14.85

RFQ

110-93-428-41-105000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-628-41-105000

110-93-628-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,738 14.85

RFQ

110-93-628-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-328-41-105000

110-43-328-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,461 14.85

RFQ

110-43-328-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-428-41-105000

110-43-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,091 14.85

RFQ

110-43-428-41-105000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-628-41-105000

110-43-628-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,071 14.85

RFQ

110-43-628-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-318-31-007000

614-93-318-31-007000

SOCKET CARRIER LOWPRO .300 18POS

Mill-Max Manufacturing Corp.

3,081 14.86

RFQ

614-93-318-31-007000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-318-31-007000

614-43-318-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,191 14.86

RFQ

614-43-318-31-007000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-322-11-480000

605-41-322-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,715 14.86

RFQ

605-41-322-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-422-11-480000

605-41-422-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,002 14.86

RFQ

605-41-422-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
26-6823-90C

26-6823-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,864 14.87

RFQ

26-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-820-90C

26-820-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,314 14.87

RFQ

26-820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-822-90C

26-822-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,978 14.87

RFQ

26-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-823-90C

26-823-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,948 14.87

RFQ

26-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-47-648-41-003000

115-47-648-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,805 14.87

RFQ

115-47-648-41-003000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-322-41-001000

123-91-322-41-001000

SOCKET IC OPEN 3 LVL .300 22POS

Mill-Max Manufacturing Corp.

2,180 14.87

RFQ

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-422-41-001000

123-91-422-41-001000

SOCKET IC OPEN 3 LVL .400 22POS

Mill-Max Manufacturing Corp.

3,487 14.87

RFQ

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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