Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-7500-10

18-7500-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

3,801 14.64

RFQ

18-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-7625-10

18-7625-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

2,366 14.64

RFQ

18-7625-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-7650-10

18-7650-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

2,427 14.64

RFQ

18-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-7740-10

18-7740-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

3,036 14.64

RFQ

18-7740-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 18 (1 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
346-99-132-41-012000

346-99-132-41-012000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.

3,899 14.65

RFQ

346-99-132-41-012000

Datasheet

Tube 346 Active SIP 32 (1 x 32) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
322-93-120-41-001000

322-93-120-41-001000

SOCKET 2 LEVEL WRAPOST SIP 20POS

Mill-Max Manufacturing Corp.

2,387 14.66

RFQ

322-93-120-41-001000

Datasheet

Tube 322 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-361-18-101111

517-87-361-18-101111

CONN SOCKET PGA 361POS GOLD

Preci-Dip

2,239 13.95

RFQ

517-87-361-18-101111

Datasheet

Bulk 517 Active PGA 361 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-7490-11

20-7490-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2,032 14.67

RFQ

20-7490-11

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7600-11

20-7600-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,446 14.67

RFQ

20-7600-11

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
104-11-318-41-780000

104-11-318-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,133 14.67

RFQ

104-11-318-41-780000

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-314-41-001000

121-13-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3,329 14.67

RFQ

121-13-314-41-001000

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-640-41-105000

110-47-640-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,244 14.67

RFQ

110-47-640-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-328-41-006000

116-41-328-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,232 14.67

RFQ

116-41-328-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-428-41-006000

116-41-428-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,431 14.67

RFQ

116-41-428-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-628-41-006000

116-41-628-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,457 14.67

RFQ

116-41-628-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-328-41-006000

116-91-328-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,993 14.67

RFQ

116-91-328-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-428-41-006000

116-91-428-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,593 14.67

RFQ

116-91-428-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-628-41-006000

116-91-628-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,987 14.67

RFQ

116-91-628-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-320-31-018000

614-93-320-31-018000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3,155 14.67

RFQ

614-93-320-31-018000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-420-31-018000

614-93-420-31-018000

SOCKET CARRIER LOWPRO .400 20POS

Mill-Max Manufacturing Corp.

2,816 14.67

RFQ

614-93-420-31-018000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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