Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-309-21-001101

510-83-309-21-001101

CONN SOCKET PGA 309POS GOLD

Preci-Dip

3,233 13.87

RFQ

510-83-309-21-001101

Datasheet

Bulk 510 Active PGA 309 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-41-316-41-001000

116-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,013 14.59

RFQ

116-41-316-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-316-41-001000

116-91-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,368 14.59

RFQ

116-91-316-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-322-11-480000

605-91-322-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,800 14.86

RFQ

605-91-322-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-422-11-480000

605-91-422-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,897 14.86

RFQ

605-91-422-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
26-6820-90C

26-6820-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,086 14.87

RFQ

26-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-6822-90C

26-6822-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,739 14.87

RFQ

26-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6572-10

24-6572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,434 14.50

RFQ

24-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6573-10

24-6573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,955 14.50

RFQ

24-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6575-10

24-6575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,475 14.50

RFQ

24-6575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3570-10

24-3570-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,507 14.50

RFQ

24-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6570-10

24-6570-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,112 14.50

RFQ

24-6570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
714-93-120-31-018000

714-93-120-31-018000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

2,039 14.51

RFQ

714-93-120-31-018000

Datasheet

Tube 714 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-316-41-001000

612-41-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,857 14.51

RFQ

612-41-316-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-316-41-001000

612-91-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,168 14.51

RFQ

612-91-316-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-43-120-41-005000

317-43-120-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

2,269 14.51

RFQ

317-43-120-41-005000

Datasheet

Tube 317 Active SIP 20 (1 x 20) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-316-41-001000

126-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,840 14.51

RFQ

126-41-316-41-001000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-316-41-001000

126-91-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,394 14.51

RFQ

126-91-316-41-001000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-118-41-005000

317-93-118-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

2,450 14.51

RFQ

317-93-118-41-005000

Datasheet

Bulk 317 Active SIP 18 (1 x 18) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-952-41-001000

110-99-952-41-001000

CONN IC DIP SOCKET 52POS TINLEAD

Mill-Max Manufacturing Corp.

3,069 14.52

RFQ

110-99-952-41-001000

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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