Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-8600-610C

18-8600-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,964 14.24

RFQ

18-8600-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8640-610C

18-8640-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,258 14.24

RFQ

18-8640-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8650-610C

18-8650-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,401 14.24

RFQ

18-8650-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8670-610C

18-8670-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,228 14.24

RFQ

18-8670-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8685-610C

18-8685-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,939 14.24

RFQ

18-8685-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8700-610C

18-8700-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,010 14.24

RFQ

18-8700-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8750-610C

18-8750-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,231 14.24

RFQ

18-8750-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8870-610C

18-8870-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,128 14.24

RFQ

18-8870-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
316-43-118-41-006000

316-43-118-41-006000

SOCKET INTERCONNECT SIP 18POS

Mill-Max Manufacturing Corp.

3,945 14.25

RFQ

316-43-118-41-006000

Datasheet

Tube 316 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-T-C

APA-648-T-C

ADAPTER PLUG

Samtec Inc.

3,341 14.25

RFQ

Bulk APA Active - 48 (2 x 24) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
111-93-328-41-001000

111-93-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,871 14.25

RFQ

111-93-328-41-001000

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-428-41-001000

111-93-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,333 14.25

RFQ

111-93-428-41-001000

Datasheet

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-328-41-001000

111-43-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,050 14.25

RFQ

111-43-328-41-001000

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-428-41-001000

111-43-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,253 14.25

RFQ

111-43-428-41-001000

Datasheet

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-636-41-001000

111-41-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,113 14.26

RFQ

111-41-636-41-001000

Datasheet

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-636-41-001000

111-91-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,809 14.26

RFQ

111-91-636-41-001000

Datasheet

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-316-41-007000

116-93-316-41-007000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,703 14.26

RFQ

116-93-316-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-316-41-007000

116-43-316-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,088 14.26

RFQ

116-43-316-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-80-144-15-081101

550-80-144-15-081101

PGA SOLDER TAIL

Preci-Dip

2,331 13.58

RFQ

550-80-144-15-081101

Datasheet

Bulk 550 Active PGA 144 (15 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-144-12-000101

550-80-144-12-000101

PGA SOLDER TAIL

Preci-Dip

3,393 13.58

RFQ

550-80-144-12-000101

Datasheet

Bulk 550 Active PGA 144 (12 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Records«Prev1... 381382383384385386387388...1100Next»
Mancore Electronics Co., Ltd.
Help you to save your cost and time.
Mancore Electronics Co., Ltd.
Reliable package for your goods.
Mancore Electronics Co., Ltd.
Fast Reliable Delivery to save time.
Mancore Electronics Co., Ltd.
Quality premium after-sale service.
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER

OnlineOnline