Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-41-316-41-001000

614-41-316-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,355 14.03

RFQ

614-41-316-41-001000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-316-41-001000

614-91-316-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,829 14.03

RFQ

614-91-316-41-001000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-642-41-001000

115-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,078 14.04

RFQ

115-41-642-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-642-41-001000

115-91-642-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

3,905 14.04

RFQ

115-91-642-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-112-41-005000

317-93-112-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

2,289 14.05

RFQ

317-93-112-41-005000

Datasheet

Bulk 317 Active SIP 12 (1 x 12) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-628-41-005000

117-41-628-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,730 14.05

RFQ

117-41-628-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-628-41-005000

117-91-628-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,782 14.05

RFQ

117-91-628-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-324-41-006000

116-41-324-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,719 14.05

RFQ

116-41-324-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-424-41-006000

116-41-424-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,251 14.05

RFQ

116-41-424-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-624-41-006000

116-41-624-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,096 14.05

RFQ

116-41-624-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-324-41-006000

116-91-324-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,727 14.05

RFQ

116-91-324-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-424-41-006000

116-91-424-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,349 14.05

RFQ

116-91-424-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-624-41-006000

116-91-624-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,564 14.05

RFQ

116-91-624-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-320-41-006000

116-93-320-41-006000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3,772 14.05

RFQ

116-93-320-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-420-41-006000

116-93-420-41-006000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2,167 14.05

RFQ

116-93-420-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-320-41-006000

116-43-320-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,521 14.05

RFQ

116-43-320-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-420-41-006000

116-43-420-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,101 14.05

RFQ

116-43-420-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-7375-10

20-7375-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

2,945 14.18

RFQ

20-7375-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7376-10

20-7376-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

3,419 14.18

RFQ

20-7376-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7380-10

20-7380-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

2,262 14.18

RFQ

20-7380-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Records«Prev1... 371372373374375376377378...1100Next»
Mancore Electronics Co., Ltd.
Help you to save your cost and time.
Mancore Electronics Co., Ltd.
Reliable package for your goods.
Mancore Electronics Co., Ltd.
Fast Reliable Delivery to save time.
Mancore Electronics Co., Ltd.
Quality premium after-sale service.
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER

OnlineOnline