Sockets for ICs, Transistors

Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-4508-20

20-4508-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,627 13.02

RFQ

20-4508-20

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-4508-30

20-4508-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,230 13.02

RFQ

20-4508-30

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-99-120-41-012000

346-99-120-41-012000

SOCKET SLDRLSS PRESSFIT SIP20POS

Mill-Max Manufacturing Corp.

2,268 13.02

RFQ

346-99-120-41-012000

Datasheet

Tube 346 Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-80-132-13-041101

550-80-132-13-041101

PGA SOLDER TAIL

Preci-Dip

2,648 12.45

RFQ

550-80-132-13-041101

Datasheet

Bulk 550 Active PGA 132 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-132-14-071101

550-80-132-14-071101

PGA SOLDER TAIL

Preci-Dip

2,436 12.45

RFQ

550-80-132-14-071101

Datasheet

Bulk 550 Active PGA 132 (14 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-47-322-41-003000

115-47-322-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,237 13.03

RFQ

115-47-322-41-003000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-314-41-003000

116-41-314-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,877 13.03

RFQ

116-41-314-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-314-41-003000

116-91-314-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,673 13.03

RFQ

116-91-314-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-328-41-001000

115-41-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,733 13.03

RFQ

115-41-328-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-428-41-001000

115-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,646 13.03

RFQ

115-41-428-41-001000

Datasheet

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-628-41-001000

115-41-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,030 13.03

RFQ

115-41-628-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-328-41-001000

115-91-328-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

2,213 13.03

RFQ

115-91-328-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-428-41-001000

115-91-428-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

2,976 13.03

RFQ

115-91-428-41-001000

Datasheet

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-628-41-001000

115-91-628-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

2,242 13.03

RFQ

115-91-628-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-322-41-003000

115-93-322-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,281 13.03

RFQ

115-93-322-41-003000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-322-41-003000

115-43-322-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,681 13.03

RFQ

115-43-322-41-003000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-318-41-001000

115-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,559 13.03

RFQ

115-41-318-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-318-41-001000

115-91-318-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

2,755 13.03

RFQ

115-91-318-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-316-41-001000

111-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,097 13.04

RFQ

111-41-316-41-001000

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-316-41-001000

111-91-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,221 13.04

RFQ

111-91-316-41-001000

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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Mancore Electronics Co., Ltd.
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Mancore Electronics Co., Ltd.
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