| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 116-83-422-41-007101CONN IC DIP SOCKET 22POS GOLD | 3,340 | 2.28 | RFQ |   Datasheet | Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 15-0513-10CONN SOCKET SIP 15POS GOLD | 3,244 | 2.44 | RFQ |   Datasheet | Bulk | 0513 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 11-0518-00CONN SOCKET SIP 11POS GOLD | 2,201 | 2.44 | RFQ |   Datasheet | Bulk | 518 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 18-0518-10HCONN SOCKET SIP 18POS GOLD | 3,271 | 2.44 | RFQ |   Datasheet | Bulk | 518 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 18-1518-10HCONN IC DIP SOCKET 18POS GOLD | 3,753 | 2.44 | RFQ |   Datasheet | Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 614-87-636-31-012101CONN IC DIP SOCKET 36POS GOLD | 2,952 | 2.51 | RFQ |   Datasheet | Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-83-328-41-003101CONN IC DIP SOCKET 28POS GOLD | 3,501 | 2.29 | RFQ |   Datasheet | Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 146-87-628-41-035101CONN IC DIP SOCKET 28POS GOLD | 2,650 | 2.45 | RFQ |   Datasheet | Bulk | 146 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 146-87-628-41-036101CONN IC DIP SOCKET 28POS GOLD | 2,747 | 2.45 | RFQ |   Datasheet | Bulk | 146 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 146-87-428-41-035101CONN IC DIP SOCKET 28POS GOLD | 3,786 | 2.30 | RFQ |   Datasheet | Bulk | 146 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 146-87-428-41-036101CONN IC DIP SOCKET 28POS GOLD | 2,688 | 2.30 | RFQ |   Datasheet | Bulk | 146 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 299-83-312-10-001101CONN IC DIP SOCKET 12POS GOLD | 2,082 | 2.30 | RFQ |   Datasheet | Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 117-87-652-41-005101CONN IC DIP SOCKET 52POS GOLD | 2,347 | 2.30 | RFQ |   Datasheet | Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-83-424-41-003101CONN IC DIP SOCKET 24POS GOLD | 3,486 | 2.30 | RFQ |   Datasheet | Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 115-87-648-41-003101CONN IC DIP SOCKET 48POS GOLD | 2,391 | 2.31 | RFQ |   Datasheet | Bulk | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 510-87-076-11-041101CONN SOCKET PGA 76POS GOLD | 3,498 | 2.29 | RFQ |   Datasheet | Bulk | 510 | Active | PGA | 76 (11 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 510-87-084-11-002101CONN SOCKET PGA 84POS GOLD | 2,315 | 2.53 | RFQ |   Datasheet | Bulk | 510 | Active | PGA | 84 (11 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 510-87-084-11-041101CONN SOCKET PGA 84POS GOLD | 3,082 | 2.53 | RFQ |   Datasheet | Bulk | 510 | Active | PGA | 84 (11 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 510-87-084-11-042101CONN SOCKET PGA 84POS GOLD | 2,465 | 2.53 | RFQ |   Datasheet | Bulk | 510 | Active | PGA | 84 (11 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 510-87-084-10-001101CONN SOCKET PGA 84POS GOLD | 3,080 | 2.31 | RFQ |   Datasheet | Bulk | 510 | Active | PGA | 84 (10 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |